| PRODUCT NAME |
Solder Composition And Method Of Production Thereof
|
| ABSTRACT |
A solder composition made of a mixture of tin, a secondary metal a\being a copper , antimony, zinc or bismuth and one or a combination of ceramic and polymer, characterized in that the size of the ceramic or polymer is less than 100 mm.
|
| FILING COUNTRY |
Malaysia
|
| REG. NUMBER |
MY-169688-A & PI 2011000849
|
| INTELLECTUAL STATUS |
Patent Granted
|
| FILE DATE |
13/5/2018
|
| IP TYPE |
Patent
|
| YEAR APPLY |
2011
|
| DEPARTMENT |
PUSAT PENGAJIAN KEJURUTERAAN BAHAN
|
| STAF NO / MATRIC NO |
MOHD ARIF ANUAR BIN MOHD SALLEH, 831117-11-5723, 0101266
|
| OWNER NAME |
UNIVERSITI MALAYSIA PERLIS
|
| EQUITY PERCENTAGE |
|
| NOTEL HP |
|
