| PRODUCT NAME |
ROBUST Pb-FREE MICRO-ALLOYED SOLDER AS HIGH POWER ELECTRONICS
|
| ABSTRACT |
|
| FILING COUNTRY |
Malaysia
|
| REG. NUMBER |
LY2022PO2466
|
| INTELLECTUAL STATUS |
Registered Copyright
|
| FILE DATE |
30/6/2022
|
| IP TYPE |
Copyright
|
| YEAR APPLY |
2022
|
| DEPARTMENT |
104
|
| STAF NO / MATRIC NO |
MOHD ARIF ANUAR BIN MOHD SALLEH, 831117-11-5723, 0101266
|
| OWNER NAME |
UNIVERSITI MALAYSIA PERLIS
|
| EQUITY PERCENTAGE |
100
|
| NOTEL HP |
|
