| PRODUCT NAME |
PROCESS FOR SUPPRESSING PRIMARY CUS26;SN5 INTERMETALLICS FORMATION TO ENHANCE SOLDER JOINT PERFORMANCE
|
| ABSTRACT |
|
| FILING COUNTRY |
Malaysia
|
| REG. NUMBER |
PI2025005894
|
| INTELLECTUAL STATUS |
Patent Filing
|
| FILE DATE |
25/9/2025
|
| IP TYPE |
Patent
|
| YEAR APPLY |
2025
|
| DEPARTMENT |
104
|
| STAF NO / MATRIC NO |
FLORA SOMIDIN, 880319-12-5728, 0102047
|
| OWNER NAME |
Universiti Malaysia Perlis
|
| EQUITY PERCENTAGE |
100
|
| NOTEL HP |
|
