| PRODUCT NAME |
Epoxy- Recycled Copper (E-Recop) as Thermoforming Mold Material
|
| ABSTRACT |
A epoxy based thermoforming mold material comprises an epoxy, a hardener and recycled copper as filler using simple fabrication method. The epoxy based thermoforming material will be an alternative to metal mold for short cycle thermoforming process.
|
| FILING COUNTRY |
Malaysia
|
| REG. NUMBER |
|
| INTELLECTUAL STATUS |
Novel
|
| FILE DATE |
|
| IP TYPE |
Patent
|
| YEAR APPLY |
2014
|
| DEPARTMENT |
PUSAT PENGAJIAN KEJURUTERAAN BAHAN
|
| STAF NO / MATRIC NO |
TEH PEI LENG, 771023-14-5698, 0101032
|
| OWNER NAME |
UNIMAP
|
| EQUITY PERCENTAGE |
|
| NOTEL HP |
12
|
