PRODUCT NAME PROCESS FOR SUPPRESSING PRIMARY CUS26;SN5 INTERMETALLICS FORMATION TO ENHANCE SOLDER JOINT PERFORMANCE
    FILING COUNTRY Malaysia
    REG. NUMBER PI2025005894
    INTELLECTUAL STATUS Patent Filing
    FILE DATE 25/9/2025
    IP TYPE Patent
    YEAR APPLY 2025
    DEPARTMENT 104
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    INTELLECTUAL PPROPERTY
    PERSON TYPE
    STAF NO / MATRIC NO
    OWNER NAME
    EQUITY PERCENTAGE
    NOTEL HP
    PROCESS FOR SUPPRESSING PRIMARY CUS26;SN5 INTERMETALLICS FORMATION TO ENHANCE SOLDER JOINT PERFORMANCE Staf MOHD ARIF ANUAR BIN MOHD SALLEH, 831117-11-5723, 0101266 Universiti Malaysia Perlis 100  
    PROCESS FOR SUPPRESSING PRIMARY CUS26;SN5 INTERMETALLICS FORMATION TO ENHANCE SOLDER JOINT PERFORMANCE Staf RITA BINTI MOHD SAID, 890915-12-5344, 0101982 Universiti Malaysia Perlis 100  
    PROCESS FOR SUPPRESSING PRIMARY CUS26;SN5 INTERMETALLICS FORMATION TO ENHANCE SOLDER JOINT PERFORMANCE Staf FLORA SOMIDIN, 880319-12-5728, 0102047 Universiti Malaysia Perlis 100  
    PROCESS FOR SUPPRESSING PRIMARY CUS26;SN5 INTERMETALLICS FORMATION TO ENHANCE SOLDER JOINT PERFORMANCE Staf NURUL RAZLIANA BINTI ABDUL RAZAK, 860610-23-6660, 0101499 Universiti Malaysia Perlis 100  
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