
| PRODUCT NAME | High Strength PB-Free Composite Interconnects For Next Generation Electric Vehicle Power Modules |
| FILING COUNTRY | Malaysia |
| REG. NUMBER | LY2020003768 |
| INTELLECTUAL STATUS | Registered Copyright |
| FILE DATE | 15/9/2020 |
| IP TYPE | Copyright |
| YEAR APPLY | 2020 |
| DEPARTMENT | 78 |