PRODUCT NAME	Solder Composition And Method Of Production Thereof
ABSTRACT	A solder composition made of a mixture of tin, a secondary metal a\being a copper , antimony, zinc or bismuth and one or a combination of ceramic and polymer, characterized in that the size of the ceramic or polymer is less than 100 mm.
FILING COUNTRY	Malaysia
REG. NUMBER	MY-169688-A & PI 2011000849
INTELLECTUAL STATUS	Patent Granted
FILE DATE	13/5/2018
IP TYPE	Patent
YEAR APPLY	2011
DEPARTMENT	PUSAT PENGAJIAN KEJURUTERAAN BAHAN