PRODUCT NAME |
A Method To Fabricate A Nanogap In Between Electronics
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ABSTRACT |
A method of fabricating nanogap in between electrodes on a patterned polysilicon substrate comprising the step of oxiding the patterned polysilicon substrate having a pair of electrodes spaced apart by a gap at a temperature ranging from 900oC to 1100oC for 100 minutes to 180 minutes, wherein the gap is reduced to nanosize upon the growing of the oxidized electrodes.
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FILING COUNTRY |
Malaysia
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REG. NUMBER |
MY-163140-A & PI 2011003126
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INTELLECTUAL STATUS |
Patent Granted
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FILE DATE |
15/8/2017
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IP TYPE |
Patent
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YEAR APPLY |
2011
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DEPARTMENT |
INSTITUT KEJURUTERAAN NANO ELEKTRONIK
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