PRODUCT NAME |
Solder Composition And Method Of Production Thereof
|
ABSTRACT |
A solder composition made of a mixture of tin, a secondary metal a\being a copper , antimony, zinc or bismuth and one or a combination of ceramic and polymer, characterized in that the size of the ceramic or polymer is less than 100 mm.
|
FILING COUNTRY |
Malaysia
|
REG. NUMBER |
MY-169688-A & PI 2011000849
|
INTELLECTUAL STATUS |
Patent Granted
|
FILE DATE |
13/5/2018
|
IP TYPE |
Patent
|
YEAR APPLY |
2011
|
DEPARTMENT |
PUSAT PENGAJIAN KEJURUTERAAN BAHAN
|
STAF NO / MATRIC NO |
MOHD ARIF ANUAR BIN MOHD SALLEH, 831117-11-5723, 0101266
|
OWNER NAME |
UNIVERSITI MALAYSIA PERLIS
|
EQUITY PERCENTAGE |
|
NOTEL HP |
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