| PRODUCT NAME |
Interconnect Substrate Surface Modification To Improve Wettability In Soldering
|
| ABSTRACT |
|
| FILING COUNTRY |
Malaysia
|
| REG. NUMBER |
LY2020003776
|
| INTELLECTUAL STATUS |
Registered Copyright
|
| FILE DATE |
15/9/2020
|
| IP TYPE |
Copyright
|
| YEAR APPLY |
2020
|
| DEPARTMENT |
78
|
| STAF NO / MATRIC NO |
JUYANA BINTI A. WAHAB, 850615-06-5224, 0101231
|
| OWNER NAME |
UNIVERSITI MALAYSIA PERLIS
|
| EQUITY PERCENTAGE |
|
| NOTEL HP |
|
