PRODUCT NAME |
Epoxy- Recycled Copper (E-Recop) as Thermoforming Mold Material
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ABSTRACT |
A epoxy based thermoforming mold material comprises an epoxy, a hardener and recycled copper as filler using simple fabrication method. The epoxy based thermoforming material will be an alternative to metal mold for short cycle thermoforming process.
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FILING COUNTRY |
Malaysia
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REG. NUMBER |
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INTELLECTUAL STATUS |
Novel
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FILE DATE |
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IP TYPE |
Patent
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YEAR APPLY |
2014
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DEPARTMENT |
PUSAT PENGAJIAN KEJURUTERAAN BAHAN
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STAF NO / MATRIC NO |
TEH PEI LENG, 771023-14-5698, 0101032
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OWNER NAME |
UNIMAP
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EQUITY PERCENTAGE |
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NOTEL HP |
12
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