PRODUCT NAME |
Automated Silicon Wet Etch System
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ABSTRACT |
This Product Will Assist the development of fabrication field in terms of wet etch process. The complete system replaced the manual wafer thinning in automated wafer thinning process by additional of components such as light density detector and motor controller. As compared to other product, high efficiency system will achieved due to continuous monitoring of wafer thickness between sample and integrated sensors in the system. Thus the final-end quality of sample will be improved.
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FILING COUNTRY |
Malaysia
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REG. NUMBER |
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INTELLECTUAL STATUS |
Novel
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FILE DATE |
20/3/2015
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IP TYPE |
Patent
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YEAR APPLY |
2015
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DEPARTMENT |
PUSAT PENGAJIAN KEJURUTERAAN MIKROELEKTRONIK
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STAF NO / MATRIC NO |
YUFRIDIN BIN WAHAB, 720611-02-5027, 0100025
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OWNER NAME |
UNIMAP
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EQUITY PERCENTAGE |
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NOTEL HP |
197917273
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