• PERSON INVOLVED
    PRODUCT NAME Solder Composition And Method Of Production Thereof
    FILING COUNTRY Malaysia
    REG. NUMBER MY-169688-A & PI 2011000849
    INTELLECTUAL STATUS Patent Granted
    FILE DATE 13/5/2018
    IP TYPE Patent
    YEAR APPLY 2011
    DEPARTMENT PUSAT PENGAJIAN KEJURUTERAAN BAHAN
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    INTELLECTUAL PPROPERTY
    PERSON TYPE
    STAF NO / MATRIC NO
    OWNER NAME
    EQUITY PERCENTAGE
    NOTEL HP
    Solder Composition And Method Of Production Thereof Staf MOHD ARIF ANUAR BIN MOHD SALLEH, 831117-11-5723, 0101266 UNIVERSITI MALAYSIA PERLIS    
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