• PERSON INVOLVED
    PRODUCT NAME Epoxy- Recycled Copper (E-Recop) as Thermoforming Mold Material
    FILING COUNTRY Malaysia
    REG. NUMBER  
    INTELLECTUAL STATUS Novel
    FILE DATE  
    IP TYPE Patent
    YEAR APPLY 2014
    DEPARTMENT PUSAT PENGAJIAN KEJURUTERAAN BAHAN
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    INTELLECTUAL PPROPERTY
    PERSON TYPE
    STAF NO / MATRIC NO
    OWNER NAME
    EQUITY PERCENTAGE
    NOTEL HP
    Epoxy- Recycled Copper (E-Recop) as Thermoforming Mold Material Staf TEH PEI LENG, 771023-14-5698, 0101032 UNIMAP   12
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