• PERSON INVOLVED
    PRODUCT NAME Growth Inhibition Of Intermetallic Compound (IMC's) In Sn-3.5Ag-0.5Cu (SAC305) Solder For A Robust
    FILING COUNTRY Malaysia
    REG. NUMBER LY2020003753
    INTELLECTUAL STATUS Registered Copyright
    FILE DATE 14/9/2020
    IP TYPE Copyright
    YEAR APPLY 2020
    DEPARTMENT 78
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    Growth Inhibition Of Intermetallic Compound (IMC's) In Sn-3.5Ag-0.5Cu (SAC305) Solder For A Robust Staf JUYANA BINTI A. WAHAB, 850615-06-5224, 0101231 UNIVERSITI MALAYSIA PERLIS    
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