PRODUCT NAME Improvement Of Sn-0.7Cu Lead Free Solder Joints On Shear Strength With Addition Of Titanium Oxide (TIO2) Particles
FILING COUNTRY Malaysia
REG. NUMBER LY2020003756
INTELLECTUAL STATUS Registered Copyright
FILE DATE 15/9/2020
IP TYPE Copyright
YEAR APPLY 2020
DEPARTMENT 78
Page 
 of 1
Records 1 to 1 of 1
INTELLECTUAL PPROPERTY
PERSON TYPE
STAF NO / MATRIC NO
OWNER NAME
EQUITY PERCENTAGE
NOTEL HP
Improvement Of Sn-0.7Cu Lead Free Solder Joints On Shear Strength With Addition Of Titanium Oxide (TIO2) Particles Staf MOHD ARIF ANUAR BIN MOHD SALLEH, 831117-11-5723, 0101266 UNIVERSITI MALAYSIA PERLIS    
Page 
 of 1
Records 1 to 1 of 1
©2014 UniMAP