• PERSON INVOLVED
    PRODUCT NAME Interconnect Substrate Surface Modification To Improve Wettability In Soldering
    FILING COUNTRY Malaysia
    REG. NUMBER LY2020003776
    INTELLECTUAL STATUS Registered Copyright
    FILE DATE 15/9/2020
    IP TYPE Copyright
    YEAR APPLY 2020
    DEPARTMENT 78
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    INTELLECTUAL PPROPERTY
    PERSON TYPE
    STAF NO / MATRIC NO
    OWNER NAME
    EQUITY PERCENTAGE
    NOTEL HP
    Interconnect Substrate Surface Modification To Improve Wettability In Soldering Staf JUYANA BINTI A. WAHAB, 850615-06-5224, 0101231 UNIVERSITI MALAYSIA PERLIS    
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