• PERSON INVOLVED
    PRODUCT NAME ROBUST Pb-FREE MICRO-ALLOYED SOLDER AS HIGH POWER ELECTRONICS
    FILING COUNTRY Malaysia
    REG. NUMBER LY2022PO2466
    INTELLECTUAL STATUS Registered Copyright
    FILE DATE 30/6/2022
    IP TYPE Copyright
    YEAR APPLY 2022
    DEPARTMENT 104
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    INTELLECTUAL PPROPERTY
    PERSON TYPE
    STAF NO / MATRIC NO
    OWNER NAME
    EQUITY PERCENTAGE
    NOTEL HP
    ROBUST Pb-FREE MICRO-ALLOYED SOLDER AS HIGH POWER ELECTRONICS Staf MOHD ARIF ANUAR BIN MOHD SALLEH, 831117-11-5723, 0101266 UNIVERSITI MALAYSIA PERLIS 100  
    ROBUST Pb-FREE MICRO-ALLOYED SOLDER AS HIGH POWER ELECTRONICS Staf AIMI NOORLIYANA BINTI HASHIM, 830422-03-5426, 0101257 UNIVERSITI MALAYSIA PERLIS 100  
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