| ABSTRACT |
Surface Finish on Printed Circuit Board(PCB) outermost layer is needed to maintain solderability of solder on the metal surface. Oxidation is an enemy to soldering process whereby with the existing of oxidation layer form on the surface will prevent the solder to react and wet on the metal of the PCB surface. Therefore , a surface finish material may not only responsible to protect the metal finish but also the solder wetting . The existing Surface Finishes available in the industries were made from least reactive material, mostly gold and nickel . Those inert metal are very expensive , hence is not convenient to be used as protecting layer or sacrificial surface. the development of Surface Finish made from organic material is one way to approach green material with sustainable resource
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