PERSON INVOLVED
PRODUCT NAME Solder Composition And Method Of Production Thereof
ABSTRACT A solder composition made of a mixture of tin, a secondary metal a\being a copper , antimony, zinc or bismuth and one or a combination of ceramic and polymer, characterized in that the size of the ceramic or polymer is less than 100 mm.
FILING COUNTRY Malaysia
REG. NUMBER MY-169688-A & PI 2011000849
INTELLECTUAL STATUS Patent Granted
FILE DATE 13/5/2018
IP TYPE Patent
YEAR APPLY 2011
DEPARTMENT PUSAT PENGAJIAN KEJURUTERAAN BAHAN
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