| ABSTRACT |
he present invention relates to a method of preparing a novel natural and synthetic organic coating for electronic metallization application that facilitates solder solderability on metal. The method comprises the steps of:
a) Mixing of solvent (e.g toluene, MEK, turpentine, etc) liquid and natural or synthetic organic (e.g rubber, plastic, thermoplastic, etc)
b) Stir mixtures in (i) until dissolve for (e.g. stir for 2-10 hours using a mixer with a uniform speed (e.g 10-200 RPM) until the natural or synthetic organic dissolves) in a controlled environment
c) Adding chemical agent or additive to modify mixtures properties (e.g. surfactants, corrosion inhibitors, wetting agents, stabilizers and antioxidants, tackifiers, thickeners, plasticizers, dyes, etc) into mixer in (ii) and is further stirred
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