PRODUCT NAME	Epoxy- Recycled Copper (E-Recop) as Thermoforming Mold Material
ABSTRACT	A epoxy based thermoforming mold material comprises an epoxy, a hardener and recycled copper as filler using simple fabrication method. The epoxy based thermoforming material will be an alternative to metal mold for short cycle thermoforming process.
FILING COUNTRY	Malaysia
REG. NUMBER
INTELLECTUAL STATUS	Novel
FILE DATE
IP TYPE	Patent
YEAR APPLY	2014
DEPARTMENT	PUSAT PENGAJIAN KEJURUTERAAN BAHAN